It is remarkable that semiconductor technology is more advanced in its capacity to create complex systems than in the ability to image the outcomes. Conventional high-resolution microscopy for imaging the interior of three-dimensionally structured objects typically entails destructive sample preparation followed by electron microscopy of resulting surfaces or sections. Here we describe X-ray ptychography, a mixed real space/reciprocal space („wavelet“) technique, which is non-destructive and provides three-dimensional images at steadily improving resolution. We show applications to integrated circuit inspection, and describe potential implications for neuroscience. References:http://www.nature.com/nature/journal/v543/n7645/abs/nature21698.htmlhtt…
